Products Archive - Page 2 of 4 - Resonac Asia Pacific

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Overview

Resonac’s mold release films are used in film assisted transfer molding processes. It helps to reduce flash burr and is applicable to a wide range of PKGs, including QFN, FC-CSP (Flip Chip-CSP), and BGA.

Features

Capable of meeting customer needs by combining thickness and surface shapes.
AS (anti-static) grades can prevent static electricity from damaging devices.
High burr resistance for exposed molding parts, such as lead frame terminals and exposed die structures.
Prevents mold contamination caused by epoxy molding compounds.
Provides stable workability with film wrinkle control and excellent mold release from epoxy molding compounds.

Film Characteristics & Line-Up

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Overview

Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding quad flat non-leaded (QFN) packages. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding.

Features

Superior wire bonding properties (including Cu wires) due to high Tg, high thermal stability, and low outgassing.
Superior performance in preventing resin leakage (burrs, mold flashes) during the molding process.
Low adhesive residue when peeling off the tape.
Contributes to enhanced productivity with stable wire bonding properties, burr prevention during molding, and low adhesive residue, especially for small package applications such as mini QFN, DFN, and SON.
Lineup suitability for Cu clip bonding and other high-temperature processes (300-400℃ reflow, etc.).

Tape Characteristics & Line-Up

※Heating is required for some lead frames and epoxy molding compounds.

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Overview

Die bonding is the process of attaching a chip and substrate. In the past, Au-Si eutectic and soldering were common processing methods, but with the increasing variety of chips and the spread of copper lead frames, the internal stress caused by a mismatch between the thermal expansion coefficients of the chip and the lead frame has become greater, making die bonding pastes able to reduce internal stress indispensable. Since internal stress and chip and substrate adhesion are the major elements of a package’s reliability, it is vital to choose the optimal die bonding paste for each type of package.

Innovative Solution

Die bonding pastes with epoxy resin as the main component have been commonly used, but conventional epoxy resin pastes require a special sealing resin to ease the internal stress. Substrate surface treatment is also necessary to increase the adhesion.

As a better solution, Resonac proposes its high reliability die bonding paste, EPINAL <EN-4900GC>, which demonstrates low elastic modulus, high adhesive strength, and excellent internal stress reduction performance. The product contributes to reducing the total cost by enabling high reliability die bonding with no extra costs for substrate treatment or other processes.

Die bonding paste with low elastic modulus and high adhesive strength realizes greater reliability and total cost reduction

In recent years, semiconductors have come to be used for a wide range of purposes, leading to the development of chips in varying sizes and thicknesses. Larger chips generate greater internal stress, but with the level of elastic modulus of conventional epoxy pastes, a special sealing resin is needed to reduce the internal stress. Dealing with the internal stress is also crucial for thin chips as they can easily warp and come off. In cases of insufficient adhesiveness, substrate surface treatment is also necessary to ensure firm adhesion.

Resonac’s high reliability die bonding paste, EPINAL <EN-4900GC>, achieves low elastic modulus and high adhesive strength with a hybrid composition of epoxy and acrylic resins and a rubber component. Even with larger chips, our product’s low elastic modulus, superior internal stress reduction performance, and high adhesive strength make high reliability die bonding possible, which contributes to driving down the total cost.

Obtaining Automotive Grade 0 and MSL1 ratings, Resonac’s EPINAL <EN-4900GC> is suitable for QFN communication chips and general-purpose automotive packages. Small chip grades and enhanced heat dissipation grades are also available. Please contact us for more information.

Product Features

Lower elastic modulus than conventional products

The elastic modulus of EPINAL <EN-4900GC> is lower than conventional epoxy pastes. The internal stress can be reduced without using a special sealing resin.

※Elastic Modulus comparison at 25^OC

Greater adhesion than conventional products

EPINAL <EN-4900GC> demonstrates greater adhesive strength than conventional epoxy pastes. Firmer adhesion can be achieved without substrate surface treatment.

※The data shown are representative values that represent examples of the results of measurements, calculations, etc., and are not guaranteed values.

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Alumina and Aluminium Hydroxide Overview

Alumina is a white powder extracted and refined from natural bauxite. It is used as the basic material of fine ceramics in a wide range of applications such as insulators, IC substrates, abrasives, artificial teeth etc.

Aluminium Hydroxide (ATH) is used in wall finishes that take advantage of its fire-retardant properties, ceramic washbasins and artificial marble kitchen counter top that make use of its white color, and also semiconductors and insulation materials that make use of its electrical insulating properties (coatings for electric wires, etc.)

Alumina Al2O3

Alumina, Al2O3, is a white powder extracted and refined from natural bauxite.

It has a high melting point, good chemical stability, high thermal conductivity, and electrical insulation.
Therefore, it is used as the most basic material in fine ceramics in a wide range of applications, such as insulators, IC substrates, abrasives, artificial teeth, etc.

Grade	Particle size (μm)	Applications	Feature
Normal	60	Porcelain, Refractory	General grade
Fine	4.7	Insulator	High compressed bulk density and high thermal reactivity
Super Fine	1.0	Refractory	Excellent sintering activity
Low Soda	60	Insulator	Raw material for resistance insultaors and heat-resistant porcelain
Thermally Reactive	0.52	IC Board	Abrasion-resistant, high-strength ceramic raw material

The data shown below are representative figures. They are not guaranteed values.

Aluminium Hydroxide Al(OH)3

Aluminum hydroxide, Al(OH)3, is an inorganic compound formed during the manufacturing process of aluminum.

Its appearance is a white powder and it is extracted from bauxite ore.

Although we rarely see them in our daily lives, they are used in a variety of things around us that are related to our lives;

Wall finishes and wallpaper that take advantage of its fire-retardant properties.
Ceramic washbasins and artificial marble kitchen counters that make use of its white color.
Semiconductors and insulation materials that make use of its electrical insulating properties (coatings for electric wires, etc.)
Aluminum hydroxide is also used as a flocculant that removes turbidity from tap water.

Grade	Particle size (μm)	Applications	Feature
Normal	55	Water treatment	Containing moisture
Fine	18	Flame retardant filler	Improve arc resistance and tracking resistance of plastic
Super Fine	1.0	Flame retardant filler	Fine particle size

The data shown below are representative figures. They are not guaranteed values.

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NPAC (n-propyl acetate)

NPAC (n-propyl acetate) is an organic solvent produced in our Oita Petrochemical Complex in Japan. It is a colorless and transparent liquid.

Special gravure printing is widely used for exterior packaging films for confectionery and frozen food as it ensures clear and beautiful images. Conventionally, aromatic and ketone (toluene and methyl ethyl ketone) solvents are mainly used as solvents for the gravure printing ink. However, demand for NPAC—an acetate-based solvent—is sharply increasing as their safe and easy-to-use substitute.

Now NPAC is globally used as solvent for photogravure ink and adhesive and more. Let’s contribute to human safety using this new solvent!

Application

Thinner for gravure ink: mixing with other solvent such as ethyl acetate (EAC), isopropanol (IPA), etc.

Adhesive: mixing with substrate (rubber etc.)

Packing Condition

ISO tank : 20MT
Bulk : 400MT~

Specification

Kindly select on one of the following links below to start your download.

Download PDF – Specification
Download PDF – MSDS

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FANCRYL Overview

Resonac is one of only four companies in the world who manufactures DCPD (dicyclopentadienyl) monomers. These monomers have numbers of unique features inherent to the chemical structure itself. Innovative Solution – Low cure shrinkage monomers improve dimensional accuracy of 3D printed objects.

Applications

(1) Low cure shrinkage monomers improve dimensional accuracy of 3D printed objects. Fancryl 500 Series has a bulky DCPD structure that contributes to low cure shrinkage when added to 3D print resin formulations, which improves the dimensional accuracy of 3D printed objects with fine, complicated shapes.

(2) Less oxygen sensitive monomers improve the yield rate of 3D print objects Fancryl 500 Series is not affected by oxygen inhibition compared to other monofunctional

Our Proposal Products Based on Applications

Applications	Products (our proposal)	Features
LCD, Touch panel adhesives	FA-511AS, FA-512AS, FA-513AS	Good curing speed, Adhesiveness, Toughness, Low permittivity
	FA-111A, FA-311A	Rapid curing, Adhesiveness, Toughness, Flexibility
	FA-512M, FA-711MM	Adjust of curing speed
LCD, Touch panel adhesives for resin	FA-400M(100)	Adhesiveness, Polymeric stability (Lower diester)
LCD resist	FA-511AS, FA-513M, FA-BZM	High Tg, Hardness, Water resistance
3D Printings	FA-511AS, FA-512AS, FA-513AS, FA-512M, FA-513M	Good curing speed, Hardness, Low shrinkage, Dimensional stability
Insulating ink	FA-511AS, FA-512AS, FA-513AS	Reducibility, Adhesiveness, Rapid curing, Lower impurity, Corrosion resistance for metal
UV inks, coatings	FA-511AS, FA-512AS, FA-513AS, FA-111A, FA-222A, FA-P240A etc.	Rapid curing, Hardness, Lower viscosity, etc.
Glasses, Photochromic lens	FA-320MP, FA-326M, FA-321M, FA-BZM, FA-220M	Lower impurity, Coloration resistance, Reducibility
Material for concrete	FA-512MT, FA-321M, FA-320MP, FA-3218M	Toughness, Lower odor, (for repair, adhesives)
	FA-400M(100), FA-1000M, FA-2000M	Hydrophilicity, (for admixture)
Floor coatings, repair material, Diluent for vinyl ester	FA-512MT, FA-124M, FA-125M, FA-321M, FA-BZM	Toughness, Lower odor

FANCRYL 500 Series Chemical Structure

Fancryl 500 Series is monofunctional (meth)acrylate with a bulky DCPD structure.

DCPD Acrylates

DCPD Methacrylates

FANCRYL Grade Lineup

Product Name: Showa Denko Materials Fancryl
Chemical Name: Acrylates and Methacrylate

Download – Grade List

Properties	FA-511AS	FA-512AS	FA-513AS	FA-512MT FA-512M	FA-513M
Structural formula
MF (MW)	C₁₃H₁₆O₂ (204)	C₁₅H₂₀O₃ (248)	C₁₃H₁₈O₂ (206)	C₁₆H₂₂O₃ (262)	C₁₄H₂₀O₂ (220)
CAS No.	33791-58-1	65983-31-5	79637-74-4	68568-19-6	34759-34-7
Appearance	Clear liquid	Clear liquid	Clear liquid	Clear liquid	Clear liquid
Viscosity (mPa·s, at 25°C)	8-18	15-25	7-17	15-25	7-17
Specific gravity (at 25°C)	1.07	1.08	1.05	1.07	1.04
Refractive index (n_D²⁵)	1.51	1.50	1.49	1.50	1.49
Tg (°C)	120	10-20	120	40-50	175

*FA-512M is distilled grade

FANCRYL Manufacturing Location

Japan: Ichihara, GOI Works

China: Nantong

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MORUNDUM™ Overview

Resonac (formerly Showa Denko) is one of the leading comprehensive manufacturers in Japan in the field of coarse-particle abrasive material, from which fine powder abrasive is made. The quality of fine powder abrasive provided by Resonac is controlled with a consistent system from coarse particle material. Fine powder abrasives require quality control tracing to materials, and for their quality stability, it is important to use high-quality materials. We develop various kinds of products as functional fine powder to meet user needs and requirements.

Product Lineup

A:	A standard brown electro-fused-alumina abrasive. Generic fine powder, used for optical polishing, general lapping, grinding wheels, coated abrasives, etc. (particle size: coarse, fine #220~#3000)
WA:	A high-purity white electro-fused-alumina abrasive, suited for applications that must avoid heating. Used for general lapping, grinding wheels, fillers, refractories, etc. (particle size: coarse, fine #240~#8000)
SA:	A single-crystal abrasive grain, suited for hard materials. In addition to a grade for general use, there are grades for resinoid bonded grinding wheels and coated abrasives.
PW:	A pink lavender color, improved WA, having a longer life span.
SM:	Having compact structure, a very tough cylindrical brown sintered alumina abrasive.
SR:	Having compact structure, a very tough cylindrical high-purity white sintered alumina abrasive. A non-fixed form grade, “SR-3” is also available.
C:	A black silicon carbide abrasive. Generic fine powder, used for general lapping, grinding wheels, coated abrasives, etc (particle size: coarse, fine #240~#4000)
GC:	A high-purity green silicon carbide abrasive. Generic fine powder, used for general lapping, grinding wheels, cutting, fillers, etc. (particle size: coarse, fine #240~#8000)

Macro and Micro Grits Size Distribution Chart

Download PDF – Macrogrits
Download PDF – Microgrits

Applications

List of applications of alumina abrasive grains and silicon carbide abrasive grains by product name.

Alumina Abrasive Grains

Product Name	Characteristics	Application
A-40	Standard brown fused alumina. Very little iron content. Mainly for vitrified bonded grinding wheels.	Grinding wheels, coated abrasives, refractories
A-43	Standard brown fused alumina. Mainly for resinoid bonded grinding wheels and abrasive blasting.	Grinding wheels, coated abrasives, abrasive blasting
A-47	Having a sharp edge and friable characteristic, is suited for softer abrasive wheels.	Precision grinding wheels
WA	High-purity white fused alumina abrasive, suited for applications that must avoid heating.	Grinding wheels, coated abrasives, fillers in resin and coatings, electrically insulating material, refractories
SA	Single-crystal type abrasive grain, suited for hard materials.	Grinding wheels, coated abrasives, abrasive blasting
PW	Pink in color, and is an improved version of the WA type. Longer lasting.	Grinding wheels, coated abrasives
SM	Having compact structure, a very tough brown sintered alumina abrasive.	Grinding wheels, barrel
SR	Having compact structure, a tough sintered high-purity white alumina abrasive.	Grinding wheels, barrel

Silicon Carbide Abrasive Grains

Product Name	Characteristics	Application
C	Standard black silicon carbide abrasive	Grinding wheels, coated abrasives, abrasive blasting, refractories
C-25	Black silicon carbide abrasive with a sharp edge	Coated abrasives
GC	High-purity green silicon carbide abrasive	Grinding wheels, refractories

Typical Properties

List of typical properties of alumina abrasive grains and silicon carbide abrasive grains by product name.

Alumina Abrasive Grains

Name	Product name	Al203 (wt%)	SiO2 (wt%)	Fe2O3 (wt%)	TiO2 (wt%)	Toughness	Knoop Hardness	Bulk Density	Characteristics
Morundum™	A-40	96.5	0.5	0.1	2.3	Regular	2020	Mid	Brown fused alumina abrasive
Morundum™	A-43	96.5	0.5	0.2	2.3	Regular	2020	Mid	Brown fused alumina abrasive
Morundum™	A-47	96.5	0.5	0.1	2.3	Friable	2020	Low	Brown fused alumina abrasive
White Morundum™	WA	99.6	0.02	0.03	Trace	Tough	2050	Mid	High-purity white fused alumina abrasive
Single Morundum^™	SA	99.6	0.03	0.03	0.3	Friable	2250	Low	Single-crystal type alumina abrasive
Pink Morundum^™	PW	99.3	0.07	0.04	0.3	Regular	2100	Mid	Fused alumina abrasive
Sinter Morundum^™	SM	88.0	3.3	4.8	3.4	Tough	1250	–	Sintered alumina abrasive
Sinter Morundum^™	SR	99.2	0.2	0.1	–	Tough	2000	–	Sintered alumina abrasive

Silicon Carbide Abrasive Grains

Name	Product name	Al203 (wt%)	SiO2 (wt%)	Fe2O3 (wt%)	TiO2 (wt%)	Toughness	Knoop Hardness	Bulk Density	Characteristics
Densic™	C	98.7	0.2	0.5	0.2	Regular	2700	Mid	Black silicon carbide abrasive
Densic™	C-25	98.0	0.3	0.8	0.3	Friable	2700	Mid	Black silicon carbide abrasive
Green Densic™	GC	99.3	0.2	0.2	0.02	Regular	–	–	–

Packaging unit: 20kg paper bag, bulk bag

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High Silica Zeolite Overview

High Silica Zeolite is a smell adsorber. It can be adapted to any type of application or stand-alone product. For example, it can be packed and put in toilet for unwanted smell adsorber until VOC treatment in industrial scale, solvent’s smell adsorption.

Unlike other deodorizer, High Silica Zeolite can fully adsorb odor you want to remove without giving any space to moisture. So, it can adsorb targeted smell at its maximum capacity.

Application

Deodorant/ VOC treatment
Recovery of high concentration of value products or reusable solvents
Skincare: Body or foot powders
Deodorizer for room and rug
Fresheners for refrigerator, freezer and food container
Additives for pet litter, baby diapers
Smell absorbable film/masterbatch

Customer Benefits

Able to overcome the troubles that cannot be solved with conventional adsorbent
Conform to FDA (Food contact grade)
Able to select various grade depends on your application

Performance

Some sample of our performance on smell adsorption, compared to others.

Kindly select on one of the following links below to start your download.

Download PDF – HSZ Performance

Grades

We do have wide range of grades to conform with your application.
Please kindly contact us for further details, so we can recommend you the best suit for your request. Or please feel free to check the main grades and application data here.

Kindly select on one of the following links below to start your download.

Download PDF – Grades

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SHOROX™ Overview

SHOROX™ is CeO₂ abrasive for glass polishing. This high quality SHOROX is developed by the long history of Tohoku Metal Chemical Co., Ltd. and the production, assessment, and management technologies of Resonac Corporation (Tohoku Metal Chemical Co., Ltd., a member of our group, industrially produced the first CeO2 abrasive in Japan.)

Applications

SHOROX™ has various range of product kinds to apply for:

Glass substrates
Optical glasses
Hard disk glass plates
Quartz
Photomasks, and others.

Hence our end users are mainly hard disk, glass disks, camera lenses manufacturers.

Specification

Download PDF – SHOROX™ Catalog

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LED Chip Overview

Visible Chips from Resonac (formerly Showa Denko) come in a wide range of specifications such as, Gallium Phosphide LED chips, Gallium Arsenic phosphide LED chips, Aluminum Gallium Arsenide LED chips, and Aluminum Indium Gallium Phosphide LED chips. We have various luminance levels and colors, such as red, green, yellow-green, yellow, and orange. They are used in various applications such as displays, automobile tail lamps, back lights, plant cultivation, and lighting.

Applications

Infrared Chips, such as Gallium Arsenide LED chips and Aluminum Gallium Arsenide LED chips, make up our infrared lineup. We have various chip structures, such as Substrate removal type, Single side 2 electrode type, and reflection type.

We also have various wavelengths and outputs ranging from 660nm to 970nm. They are used in applications such as remote controls, sensors, opto couplers, opto-interrupters, and medical.

Catalog and Specification

We do have wide range of grades to conform with your application.
Please contact us for further details, so we can recommend you the best suit for your request. Or please feel free to check the main grades and application data here.

Catalogue Download

Download PDF – LED Chip 2022 Catalogue
Download PDF – Infrared LED chip for Optocoupler

Data Sheet – MOCVD LED

Download PDF – P85-26ATA
Download PDF – P85-26GTA
Download PDF – R66-26GSA
Download PDF – R66-35GSA
Download PDF – R69-52GSA
Download PDF – R78-26GSE
Download PDF – R78-35GSE
Download PDF – R81-35GSE
Download PDF – R85-26GSE
Download PDF – R85-35GSE
Download PDF – R85-52GSE
Download PDF – R85-110GWS
Download PDF – R87-35GSE
Download PDF – R94-35GSE
Download PDF – R94-110GWS
Download PDF – R97-35GSE

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Mold Release Film (RM)

Overview

Features

Film Characteristics & Line-Up

Contact Us

Product Enquiry

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Map Molding Support Tape (RT)

Overview

Features

Tape Characteristics & Line-Up

Contact Us

Product Enquiry

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EN-4900GC Die Bonding Paste – Total Cost Reduction Solution

Overview

Innovative Solution

Product Features

Contact Us

Product Enquiry

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Alumina & Aluminium Hydroxide

Alumina and Aluminium Hydroxide Overview

Alumina Al2O3

Aluminium Hydroxide Al(OH)3

Contact Us

Product Enquiry

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NPAC (solvent)

NPAC (n-propyl acetate)

Application

Packing Condition

Specification

Contact Us

Product Enquiry

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FANCRYL

FANCRYL Overview

Applications

Our Proposal Products Based on Applications

FANCRYL 500 Series Chemical Structure

FANCRYL Grade Lineup

FANCRYL Manufacturing Location

Contact Us

Product Enquiry

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MORUNDUM™ (Alumina)

MORUNDUM™ Overview

Product Lineup

Macro and Micro Grits Size Distribution Chart

Applications

Alumina Abrasive Grains

Silicon Carbide Abrasive Grains

Typical Properties

Alumina Abrasive Grains

Silicon Carbide Abrasive Grains

Contact Us

Product Enquiry

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High Silica Zeolite

High Silica Zeolite Overview

Application

Application

Customer Benefits

Performance

Grades

Contact Us

Product Enquiry

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SHOROX™

SHOROX™ Overview

Applications

Specification

Contact Us

Product Enquiry

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LED Chip

LED Chip Overview

Applications