— Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60% — Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) will increase its capacity to produce “Dicing Die Bonding Film,” which is a two-in-one adhesive film with the functions for both dicing tape and die bonding film used in semiconductor packaging process (backend process), […]