Low-melting Glass for Hermetic Sealing (Vaneetect)

Construction

Overview

The building industry aims to improve the thermal insulation property of glass windows in the pursuit of more energy-efficient buildings. With double-glazed glass in widespread use, vacuum insulated glass (VIG) is expected to become increasingly popular to meet the demand for better insulation performance.

VIG uses glass instead of conventional rubber or resin, as requires sealing materials that ensure high airtightness. However, forming junctions of glass-based sealing materials involves a high-temperature heating process and poses the challenge of reducing energy consumption during VIG manufacturing. To meet this challenge, Resonac proposes its low-melting glass “Vaneetect <VS-1305B>.” This material contains silver and tellurium in its main component vanadium and can be used for hermetic sealing applications with a low-temperature heating process.

Vaneetect VS Series

Vaneetect VS-1305B

Vacuum Insulated Glass

Innovative Solution

Realizing highly reliable bonding strength even when sealing at low temperatures

VIG is manufactured by laminating sealant-coated glass with another sheet of glass, heating while degassing to melt the sealant, and forming a vacuum layer between the two glass sheets. As heating is the most energy-intensive manufacturing process, energy conservation presents a challenge for conventional VIG manufacturing involving heating at temperatures 400°C or higher.

Resonac’s low-melting glass “Vaneetect <VS-1305B>” allows VIG to be manufactured with less energy than conventional models as it forms a hermetically sealed bond with heating at 300°C.

Resonac’s material also enables the production of VIG using tempered glass. Tempered glass develops strength by accumulating stress on its surface and interior, but when heated at above 300°C, the glass releases the stress resulting in lower strength. Our material provides reliable sealing at 300°C, thereby contributing to the development of tempered VIG.

  • Manufacturing Process of VIG

Features

Lowering the temperature and shortening the time in the heating process of VIG manufacturing to reduce energy consumption

Achieving reliable bonding with conventional sealants requires heating at 400°C or higher. On the other hand, Resonac’s material provides hermetic sealing with a heating temperature at 300°C and shorter processing time.

Below is a diagram of temperature changes at sealing temperatures of 300°C and 470°C, with temperature indicated on the vertical axis and process time on the horizontal axis. The diagram shows that the heating process time can be shortened by lowering the sealing temperature, and how much energy consumption can be reduced depending on the conditions of the sealing temperatures and process time. Please contact Resonac for further details.

  • Heating pattern for VIG panel sealing

※The data are representative values showing examples of the measurement and calculation results, and do not guarantee quality.

  • Free of PB and other substances restricted by the RoHS Directive

Resonac’s materials consists mainly of vanadium, blended with silver and tellurium, and is free of substances restricted by the EU’s RoHS Directive. With no lead contained, Resonac’s VIG can be recycled as glass.

Applications

Generally targeted at Glass, window sash manufactures as sealing materials for vacuum insulated glass.

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    Mold Release Film (RM)

    Semiconductor (Backend)

    Overview

    Resonac’s mold release films are used in film assisted transfer molding processes. It helps to reduce flash burr and is applicable to a wide range of PKGs, including QFN, FC-CSP (Flip Chip-CSP), and BGA.

    Features

    • Capable of meeting customer needs by combining thickness and surface shapes.
    • AS (anti-static) grades can prevent static electricity from damaging devices.
    • High burr resistance for exposed molding parts, such as lead frame terminals and exposed die structures.
    • Prevents mold contamination caused by epoxy molding compounds.
    • Provides stable workability with film wrinkle control and excellent mold release from epoxy molding compounds.

    Film Characteristics & Line-Up

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      Map Molding Support Tape (RT)

      Semiconductor (Backend)

      Overview

      Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding quad flat non-leaded (QFN) packages. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding.

      Features

      • Superior wire bonding properties (including Cu wires) due to high Tg, high thermal stability, and low outgassing.
      • Superior performance in preventing resin leakage (burrs, mold flashes) during the molding process.
      • Low adhesive residue when peeling off the tape.
      • Contributes to enhanced productivity with stable wire bonding properties, burr prevention during molding, and low adhesive residue, especially for small package applications such as mini QFN, DFN, and SON.
      • Lineup suitability for Cu clip bonding and other high-temperature processes (300-400℃ reflow, etc.).

      Tape Characteristics & Line-Up

      ※Heating is required for some lead frames and epoxy molding compounds.

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        EN-4900GC Die Bonding Paste – Total Cost Reduction Solution

        Die Bonding Paste (DBP)

        Overview

        Die bonding is the process of attaching a chip and substrate. In the past, Au-Si eutectic and soldering were common processing methods, but with the increasing variety of chips and the spread of copper lead frames, the internal stress caused by a mismatch between the thermal expansion coefficients of the chip and the lead frame has become greater, making die bonding pastes able to reduce internal stress indispensable. Since internal stress and chip and substrate adhesion are the major elements of a package’s reliability, it is vital to choose the optimal die bonding paste for each type of package.

        Innovative Solution

        Die bonding pastes with epoxy resin as the main component have been commonly used, but conventional epoxy resin pastes require a special sealing resin to ease the internal stress. Substrate surface treatment is also necessary to increase the adhesion.

        As a better solution, Resonac proposes its high reliability die bonding paste, EPINAL <EN-4900GC>, which demonstrates low elastic modulus, high adhesive strength, and excellent internal stress reduction performance. The product contributes to reducing the total cost by enabling high reliability die bonding with no extra costs for substrate treatment or other processes.

        Die bonding paste with low elastic modulus and high adhesive strength realizes greater reliability and total cost reduction

        In recent years, semiconductors have come to be used for a wide range of purposes, leading to the development of chips in varying sizes and thicknesses. Larger chips generate greater internal stress, but with the level of elastic modulus of conventional epoxy pastes, a special sealing resin is needed to reduce the internal stress. Dealing with the internal stress is also crucial for thin chips as they can easily warp and come off. In cases of insufficient adhesiveness, substrate surface treatment is also necessary to ensure firm adhesion.

        Resonac’s high reliability die bonding paste, EPINAL <EN-4900GC>, achieves low elastic modulus and high adhesive strength with a hybrid composition of epoxy and acrylic resins and a rubber component. Even with larger chips, our product’s low elastic modulus, superior internal stress reduction performance, and high adhesive strength make high reliability die bonding possible, which contributes to driving down the total cost.

        Obtaining Automotive Grade 0 and MSL1 ratings, Resonac’s EPINAL <EN-4900GC> is suitable for QFN communication chips and general-purpose automotive packages. Small chip grades and enhanced heat dissipation grades are also available. Please contact us for more information.

        Product Features

        • Lower elastic modulus than conventional products

        The elastic modulus of EPINAL <EN-4900GC> is lower than conventional epoxy pastes. The internal stress can be reduced without using a special sealing resin.

        ※Elastic Modulus comparison at 25OC

        • Greater adhesion than conventional products

        EPINAL <EN-4900GC> demonstrates greater adhesive strength than conventional epoxy pastes. Firmer adhesion can be achieved without substrate surface treatment.

        ※The data shown are representative values that represent examples of the results of measurements, calculations, etc., and are not guaranteed values.

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          Cleaning Sheet for Rubber Molding

          Industrial

          Overview

          Complete removal of rubber residue and gas stains that stick to a mold is required in order to maintain the quality of molded rubber products. However, cleaning molds with a solvent, blasting material, or brush has problems: it cannot remove stains sufficiently and it requires additional processes and time other than cleaning, such as cooling and disassembling molds.

          The Mold Cleaning Sheets that we developed can clean molds by simply sandwiching them between molds and heating them. They not only shorten the cleaning time but also boost productivity and ensure quality.

          Innovative Solution

          The conventional mold cleaning method includes numerous processes other than cleaning, such as cooling and removing a mold before cleaning, and attaching and warming a mold after cleaning, which are both labour- and time-consuming.

          • Clean molds without removing them from a molding machine

          Our Mold Cleaning Sheets are mainly cleaning materials composed of thermosetting synthetic rubber. The cleaning agent contained in the sheets permeates and dissolves stains, and the adhesive force of the synthetic rubber removes the stain components. Our cleaning sheets do not require the disassembly of a mold for cleaning. Moreover, rubber residue and gas stains sticking to the mold can be removed in the same process as in the molding process: they are sandwiched between the molds equipped to the molding machine and heated.

          i. Cleaning Mechanism of Mold Cleaning Sheets

          Product Features

          • Realize rapid mold cleaning

          You can clean even a heavy mold without detaching and attaching molds, which improves work safety and significantly reduce the number of cleaning processes.

          i. Example of how our cleaning sheets reduce the required time in a mold cleaning process

          • Improve safety & quality in mold cleaning processes

          The blast cleaning method, where stains sticking to the surface of molds are removed by colliding blast materials (granular materials) to them, has problems: it may deteriorate the quality of the molded products, such as making scratches on the mold surface due to the blast materials and scattering blast material. Our Mold Cleaning Sheets remove stains by adhering them to the surface of the sheets, which prevents mold deterioration caused by cleaning.

           i. Terms of use (Recommended)

            • Molding method: compression molding/transfer molding
            • Mold: vertical type
            • Mold application temperature: 140 to 190℃
            • Target: rubber

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            Alumina & Aluminium Hydroxide

            Industrial

            Alumina and Aluminium Hydroxide Overview

            Alumina is a white powder extracted and refined from natural bauxite. It is used as the basic material of fine ceramics in a wide range of applications such as insulators, IC substrates, abrasives, artificial teeth etc.

            Aluminium Hydroxide (ATH) is used in wall finishes that take advantage of its fire-retardant properties, ceramic washbasins and artificial marble kitchen counter top that make use of its white color, and also semiconductors and insulation materials that make use of its electrical insulating properties (coatings for electric wires, etc.)

            Alumina Al2O3

            Alumina, Al2O3, is a white powder extracted and refined from natural bauxite.

            It has a high melting point, good chemical stability, high thermal conductivity, and electrical insulation.
            Therefore, it is used as the most basic material in fine ceramics in a wide range of applications, such as insulators, IC substrates, abrasives, artificial teeth, etc.

            Grade Particle size
            (μm)
            Applications Feature
            Normal 60 Porcelain, Refractory General grade
            Fine 4.7 Insulator High compressed bulk density and high thermal reactivity
            Super Fine 1.0 Refractory Excellent sintering activity
            Low Soda 60 Insulator Raw material for resistance insultaors and heat-resistant porcelain
            Thermally Reactive 0.52 IC Board Abrasion-resistant, high-strength ceramic raw material

            The data shown below are representative figures. They are not guaranteed values.

            Aluminium Hydroxide Al(OH)3

            Aluminum hydroxide, Al(OH)3, is an inorganic compound formed during the manufacturing process of aluminum.

            Its appearance is a white powder and it is extracted from bauxite ore.

            Although we rarely see them in our daily lives, they are used in a variety of things around us that are related to our lives;

            • Wall finishes and wallpaper that take advantage of its fire-retardant properties.
            • Ceramic washbasins and artificial marble kitchen counters that make use of its white color.
            • Semiconductors and insulation materials that make use of its electrical insulating properties (coatings for electric wires, etc.)
            • Aluminum hydroxide is also used as a flocculant that removes turbidity from tap water.
            Grade Particle size
            (μm)
            Applications Feature
            Normal 55 Water treatment Containing moisture
            Fine 18 Flame retardant filler Improve arc resistance and tracking resistance of plastic
            Super Fine 1.0 Flame retardant filler Fine particle size

            The data shown below are representative figures. They are not guaranteed values.

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              NPAC (solvent)

              Packaging & Print

              NPAC (n-propyl acetate)

              NPAC (n-propyl acetate) is an organic solvent produced in our Oita Petrochemical Complex in Japan. It is a colorless and transparent liquid.

              Special gravure printing is widely used for exterior packaging films for confectionery and frozen food as it ensures clear and beautiful images. Conventionally, aromatic and ketone (toluene and methyl ethyl ketone) solvents are mainly used as solvents for the gravure printing ink. However, demand for NPAC—an acetate-based solvent—is sharply increasing as their safe and easy-to-use substitute.

              Now NPAC is globally used as solvent for photogravure ink and adhesive and more. Let’s contribute to human safety using this new solvent!

              Application

              Thinner for gravure ink: mixing with other solvent such as ethyl acetate (EAC), isopropanol (IPA), etc.

              Adhesive: mixing with substrate (rubber etc.)

              Packing Condition

              ISO tank : 20MT
              Bulk         : 400MT~

              Specification

              Kindly select on one of the following links below to start your download.

              Download PDF – Specification
              Download PDF – MSDS

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                FANCRYL

                Industrial

                FANCRYL Overview

                Resonac is one of only four companies in the world who manufactures DCPD (dicyclopentadienyl) monomers. These monomers have numbers of unique features inherent to the chemical structure itself. Innovative Solution – Low cure shrinkage monomers improve dimensional accuracy of 3D printed objects.

                Applications

                (1) Low cure shrinkage monomers improve dimensional accuracy of 3D printed objects. Fancryl 500 Series has a bulky DCPD structure that contributes to low cure shrinkage when added to 3D print resin formulations, which improves the dimensional accuracy of 3D printed objects with fine, complicated shapes.

                (2) Less oxygen sensitive monomers improve the yield rate of 3D print objects Fancryl 500 Series is not affected by oxygen inhibition compared to other monofunctional

                Our Proposal Products Based on Applications

                Applications Products (our proposal) Features
                LCD, Touch panel
                adhesives
                FA-511AS, FA-512AS,
                FA-513AS
                Good curing speed, Adhesiveness, Toughness, Low permittivity
                FA-111A, FA-311A Rapid curing, Adhesiveness, Toughness, Flexibility
                FA-512M, FA-711MM Adjust of curing speed
                LCD, Touch panel
                adhesives for resin
                FA-400M(100) Adhesiveness, Polymeric stability (Lower diester)
                LCD resist FA-511AS, FA-513M,
                FA-BZM
                High Tg, Hardness, Water resistance
                3D Printings FA-511AS, FA-512AS,
                FA-513AS, FA-512M,
                FA-513M
                Good curing speed, Hardness, Low shrinkage, Dimensional stability
                Insulating ink FA-511AS, FA-512AS,
                FA-513AS
                Reducibility, Adhesiveness, Rapid curing, Lower impurity, Corrosion resistance for metal
                UV inks, coatings FA-511AS, FA-512AS,
                FA-513AS, FA-111A,
                FA-222A, FA-P240A etc.
                Rapid curing, Hardness, Lower viscosity, etc.
                Glasses,
                Photochromic lens
                FA-320MP, FA-326M,
                FA-321M, FA-BZM,
                FA-220M
                Lower impurity, Coloration resistance, Reducibility
                 Material for concrete FA-512MT, FA-321M,
                FA-320MP, FA-3218M
                Toughness, Lower odor, (for repair, adhesives)
                FA-400M(100),
                FA-1000M, FA-2000M
                Hydrophilicity, (for admixture)
                Floor coatings,
                repair material,
                Diluent for vinyl ester
                FA-512MT, FA-124M,
                FA-125M, FA-321M,
                FA-BZM
                Toughness, Lower odor

                FANCRYL 500 Series Chemical Structure

                Fancryl 500 Series is monofunctional (meth)acrylate with a bulky DCPD structure.

                DCPD Acrylates

                DCPD Methacrylates

                FANCRYL Grade Lineup


                Product Name: Showa Denko Materials Fancryl
                Chemical Name: Acrylates and Methacrylate

                Download – Grade List

                Properties FA-511AS FA-512AS FA-513AS FA-512MT
                FA-512M
                FA-513M
                Structural
                formula
                    
                MF (MW) C13H16O2 (204) C15H20O3 (248) C13H18O2 (206) C16H22O3 (262) C14H20O2 (220)
                CAS No. 33791-58-1 65983-31-5 79637-74-4 68568-19-6 34759-34-7
                Appearance Clear liquid Clear liquid Clear liquid Clear liquid Clear liquid
                Viscosity (mPa·s, at 25°C)  8-18 15-25 7-17 15-25 7-17
                Specific
                gravity (at 25°C)
                1.07 1.08 1.05 1.07 1.04
                Refractive index (nD25)
                1.51 1.50 1.49 1.50 1.49
                Tg (°C) 120 10-20 120 40-50 175

                *FA-512M is distilled grade

                FANCRYL Manufacturing Location

                Japan: Ichihara, GOI Works

                China: Nantong

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                  LiB Packaging Material

                  Electronics

                  LiB Packaging

                  Aluminum laminated film SPALF™ is a composite of aluminum foil and resin film, and it is used as the pouch for LiB.
                  Because it is more flexible in molding, is more lightweight and has the better heat radiation characteristics than a metal-can, it is being used as the casing of small size LiB for the portable devices such as smartphone, tablet PC and notebook PC.
                  It is anticipated that it will be adopted in the large-scale LIB of such as electronic vehicles, and storage batteries in the near future.

                  Product Lineup

                  SPALF™ (Packaging Material for Lithium Ion Battery)

                  Description: Aluminum laminated film SPALF™ is a composite of aluminum foil and resin film, and it is used as the pouch for LiB.
                  Application: LIB packaging for smart phone and tablet
                  Benefits: Flexible for molding
                  Excellent heat dissipation

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                    MORUNDUM™ (Alumina)

                    Industrial

                    MORUNDUM™ Overview

                    Resonac (formerly Showa Denko) is one of the leading comprehensive manufacturers in Japan in the field of coarse-particle abrasive material, from which fine powder abrasive is made. The quality of fine powder abrasive provided by Resonac is controlled with a consistent system from coarse particle material. Fine powder abrasives require quality control tracing to materials, and for their quality stability, it is important to use high-quality materials. We develop various kinds of products as functional fine powder to meet user needs and requirements.

                    Product Lineup

                    A: A standard brown electro-fused-alumina abrasive. Generic fine powder, used for optical polishing, general lapping, grinding wheels, coated abrasives, etc.
                    (particle size: coarse, fine #220~#3000)
                    WA: A high-purity white electro-fused-alumina abrasive, suited for applications that must avoid heating. Used for general lapping, grinding wheels, fillers, refractories, etc. (particle size: coarse, fine #240~#8000)
                    SA: A single-crystal abrasive grain, suited for hard materials. In addition to a grade for general use, there are grades for resinoid bonded grinding wheels and coated abrasives.
                    PW: A pink lavender color, improved WA, having a longer life span.
                    SM: Having compact structure, a very tough cylindrical brown sintered alumina abrasive.
                    SR: Having compact structure, a very tough cylindrical high-purity white sintered alumina abrasive. A non-fixed form grade, “SR-3” is also available.
                    C: A black silicon carbide abrasive. Generic fine powder, used for general lapping, grinding wheels, coated abrasives, etc (particle size: coarse, fine #240~#4000)
                    GC: A high-purity green silicon carbide abrasive. Generic fine powder, used for general lapping, grinding wheels, cutting, fillers, etc. (particle size: coarse, fine #240~#8000)

                    Macro and Micro Grits Size Distribution Chart

                    Download PDF – Macrogrits
                    Download PDF – Microgrits

                    Applications

                    List of applications of alumina abrasive grains and silicon carbide abrasive grains by product name.

                    Alumina Abrasive Grains

                    Product Name Characteristics Application
                    A-40 Standard brown fused alumina. Very little iron content. Mainly for vitrified bonded grinding wheels. Grinding wheels, coated abrasives, refractories
                    A-43 Standard brown fused alumina. Mainly for resinoid bonded grinding wheels and abrasive blasting. Grinding wheels, coated abrasives, abrasive blasting
                    A-47 Having a sharp edge and friable characteristic, is suited for softer abrasive wheels. Precision grinding wheels
                    WA High-purity white fused alumina abrasive, suited for applications that must avoid heating. Grinding wheels, coated abrasives, fillers in resin and coatings, electrically insulating material, refractories
                    SA Single-crystal type abrasive grain, suited for hard materials. Grinding wheels, coated abrasives, abrasive blasting
                    PW Pink in color, and is an improved version of the WA type. Longer lasting. Grinding wheels, coated abrasives
                    SM Having compact structure, a very tough brown sintered alumina abrasive. Grinding wheels, barrel
                    SR Having compact structure, a tough sintered high-purity white alumina abrasive. Grinding wheels, barrel

                    Silicon Carbide Abrasive Grains

                    Product Name Characteristics Application
                    C Standard black silicon carbide abrasive Grinding wheels, coated abrasives, abrasive blasting, refractories
                    C-25 Black silicon carbide abrasive with a sharp edge Coated abrasives
                    GC High-purity green silicon carbide abrasive Grinding wheels, refractories

                    Typical Properties

                    List of typical properties of alumina abrasive grains and silicon carbide abrasive grains by product name.

                    Alumina Abrasive Grains

                    Name Product name Al203
                    (wt%)
                    SiO2
                    (wt%)
                    Fe2O3
                    (wt%)
                    TiO2
                    (wt%)
                    Toughness Knoop Hardness Bulk Density Characteristics
                    Morundum™ A-40 96.5 0.5 0.1 2.3 Regular 2020 Mid Brown fused alumina abrasive
                    Morundum™ A-43 96.5 0.5 0.2 2.3 Regular 2020 Mid Brown fused alumina abrasive
                    Morundum™ A-47 96.5 0.5 0.1 2.3 Friable 2020 Low Brown fused alumina abrasive
                    White Morundum™ WA 99.6 0.02 0.03 Trace Tough 2050 Mid High-purity white fused alumina abrasive
                    Single Morundum SA 99.6 0.03 0.03 0.3 Friable 2250 Low Single-crystal type alumina abrasive
                    Pink Morundum PW 99.3 0.07 0.04 0.3 Regular 2100 Mid Fused alumina abrasive
                    Sinter Morundum SM 88.0 3.3 4.8 3.4 Tough 1250 Sintered alumina abrasive
                    Sinter Morundum SR 99.2 0.2 0.1 Tough 2000 Sintered alumina abrasive

                     

                    Silicon Carbide Abrasive Grains

                    Name Product name Al203
                    (wt%)
                    SiO2
                    (wt%)
                    Fe2O3
                    (wt%)
                    TiO2
                    (wt%)
                    Toughness Knoop Hardness Bulk Density Characteristics
                    Densic™ C 98.7 0.2 0.5 0.2 Regular 2700 Mid Black silicon carbide abrasive
                    Densic™ C-25 98.0 0.3 0.8 0.3 Friable 2700 Mid Black silicon carbide abrasive
                    Green Densic™ GC 99.3 0.2 0.2 0.02 Regular

                    Packaging unit: 20kg paper bag, bulk bag

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